Cost efficient manufacturing process
The manufacturing of the chip carriers is done by a multistage micro-machining process. A silicon wafer is structured by photolithography and several etching processes. The electrical conductivity is realized by metallization of the wafer. Finally, the wafer is cut to separate chip carriers. Due to the modular design and depending on the required number of channels the carriers can be cut to the appropriate size. It exists three different versions for the following LiTaO3 sensor element sizes: (1.2 x 0.8) mm², (1.4 x 1.4) mm² and (2 x 2) mm².
The detector assembly is done by automated die attach and wire bonding processes. The chip carriers can easily be taken from the wafer. Compared to standard detectors, the size of the most costly infrared filters is reduced, causing also a reduction of the material costs.
Based on a novel micro-machined chip carrier, a new family of miniaturized multi-channel detectors was developed. The concept expands the available degrees of freedom regarding the detector design and opportunities to optimize the detector. The newly introduced LRM-254 (TO39, four-channel) and LRM-202 (TO46, dual-channel) are very compact, thermally compensated (uncompensated also possible) voltage mode detectors. They especially meet the needs of space-saving measurement modules for gas analysis. Currently the LRM254 will be expanded by a single supply current mode type (LRM-284) with an integrated operational amplifier, whereby the integration density will be increased again.
 G. Wiegleb, Gasmesstechnik in Theorie und Praxis: Messgeräte, Sensoren, Anwendungen. Wiesbaden: Springer Vieweg, 2016.
 S.G. Porter, A Brief Guide to Pyroelectric Detectors, Ferroelectrics, Vol. 33, 193-206, (1981); doi:10.1080/00150198108008086
 InfraTec GmbH; Catalog 2013: Pyroelectric & Multispectral Detectors, Dresden, InfraTec GmbH Infrarotsensorik und Messtechnik, 2013.
Source of the first publication: Open link.
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