Thermal Optimisation of Components and Assemblies
Improve product features and process characteristics based on energy optimisation
- Thermal images allow for detailed analysis of heat developments of components and processes
- Hot spots may indicate faults and room for optimization
- High number of pixels of infrared cameras prevent risk of wrong measurements
Heat as One Important Energy Factor Can Be Controlled
On Demand: Applications for Thermal Imaging on Wind Power Systems
- General information about infrared thermography and presentation of different infrared camera techniques
- Monitoring wind turbine power plants by (passive) thermography
- Principle & methods of active thermography and examples
- Technical lecture:
- “Inspection of Wind Turbine Blades with Ground-based Passive Thermography” / Michael Stamm, BAM Federal Institute for Materials Research and Testing
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Optimisation of Components or Processes by Heat Input or Drainage

If thermal imaging indicates hot spots at a PCB there are temperatures with a specially high temperature and this could indicate problems. If this is a normal temperature the heat drainage might still be improvable. Like this overheating of components or bordering components could be prevented. To detect the hot-spots a sufficient geometrical resolution is crucial. Only details which are well resolved by a sufficient number of pixels can be measured correctly. Therefore high-resolution infared camera systems by InfraTec are first choice for usage in product development.