E-LIT – Lock-In Thermography for electronics is an automated testing solution system (as part of NDT techniques) which allows non-contact (electrical) failure analysis of semiconductor material during the manufacturing process. Inhomogeneous temperature distribution, local power loss, leakage currents, resistive vias, cold joints, latch-up effects and soldering issues can be measured with Lock-in Thermography. This is achieved by using the shortest measurement times combined with a high-performance thermographic camera and a specialised lock-in procedure.
The power supply for this process is clocked with a synchronization module and failures that produce mK or even μK temperature differences are reliably detected by the Lock-in Thermography system.
Smallest defects at electronic components like point and line shunts, issues from overheating, internal (ohmic) shorts, oxide defects, transistor and diode failures on a PCB surface, in integrated circuits (IC´s), LED modules and battery cells can be detected and displayed in x and y positions. Additionally, it is possible to analyse stacked-die packages or multi-chip modules in z-direction with merely changing the lock-in frequency.
The powerful Lock-in Thermography software uses the latest algorithms and routines from most recent scientific publications.
E-LIT is extremely powerful also in resolving smallest geometrical structures as it can be equipped with strong microscopic lenses and additional SIL lenses. Identifying smallest structures with InfraTec´s E-LIT does not mean that the resulting field of view will also be smallest – implementing thermal cameras with detector sizes of up to (1,920 x 1,536) pixels provide large scale microscopic imaging. For even larger imaging stitching options are available.
Benefits of the Modular Test Bench
Measurement with one workstation: from the entire circuit board to the smallest detail
- Customised modular measuring station, e. g. with X-Y table and Z-axis manually or motorised adjustable, for positioning and individual adjustment of the working distances, depending on the size of the measured object
- Flexibility through variable components, e. g. different optics, holding devices for the test specimen or contacting options
- Online lock-in measurement with the highest sensitivity
- Complete and detailed microscopy analysis
- Geometrical resolution up to 1.3 μm per pixel with microscope lenses
- Thermal resolution in the microkelvin range
- Multi-layer analysis
- Automatic scanning of larger samples due to precision mechanics
Thermographic Images with Different Optics
Thermographic Software IRBIS® 3 active
- Operational software with comprehensive analysis options in laboratory conditions
- Software add-on for automatic error classification based on parameter settings
- Intuitive user interface for easy operation
- Real-time display of the object being measured in various states
- Multifaceted memory options for image data and measurement results
- Alternative 0°, 90° or customised set phase angle image for representation of complex intensity information
- Merging live and amplitude image
- Optional: IV measurement, under sampling, drift compensation, DC-mode, power loss measurement, user and protocol administration, interface preparation: e.g. Profibus, Ethernet
