Thermography for Material Testing
Efficient non-destructive testing of a wide variety of materials and defect types
- Non-destructive testing saves time and costs
- Analysation of process immanent temperature differences or externally induced heat streams
- Pulsing activation allows the detection of below-surface errors
- In-line applications for permanent quality control possible
Infrared Camera Systems Minimise Product Waste from Testing Procedures
Material tests using thermal imaging save time and costs as test objects will not be destroyed during process. They can be used for further testing or locating quality problems that could be corrected. NDT tests with infrared camera systems provide good solutions with greater applications as they can be used for a wide range of different materials and types of defects. A huge advantage is that thermographic testing procedures can be applied to larger areas at once in comparison to ultrasonic or other methods that focus on smaller zones.
On Demand: Applications for Thermal Imaging on Wind Power Systems
- General information about infrared thermography and presentation of different infrared camera techniques
- Monitoring wind turbine power plants by (passive) thermography
- Principle & methods of active thermography and examples
- Technical lecture:
- “Inspection of Wind Turbine Blades with Ground-based Passive Thermography” / Michael Stamm, BAM Federal Institute for Materials Research and Testing
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On Demand: Efficient Material Testing – Non-destructive and Contactless
- Theoretical background – mechanical force, stress and temperature Methods for analysis
- Examples from practice with application samples – elastic periodical load test and fatigue test
- Short overview about InfraTec products
- Technical lecture:
- “Some illustrations of the contribution of quantitative infrared thermography in mechanical engineering: application to cyclic loading” / Vincent Le Saux Professor in Mechanics, ENSTA Bretagne
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Trailer: Stress Analysis with Thermography
On Demand: Infrared Lock-in Thermography for Inspection of Electronics and Integrated Circuits
- Failure analysis and defect inspection
- Quality and process control
- Flexible R&D solution
- Hotspot detection on printed circuit boards, integrated circuits, semiconductor material and multi-chip modules
- Detection of faulty thermal connections of heat sinks, short circuits, soldering defects and wire bonding errors
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Passive Thermography as well as Active Heat Flow Thermography Locates Defects
Which method of thermography is used for material testing depends decisively on the question of the origin of the heating of the test object. In one test mode, it could stem directly from heating the test object gains during its production process. This case is referred to as passive thermography. The other possibility is called active heat flow thermography or just active thermography. This is when the test object will be thermally activated by an external energy input for instance by a halogen radiator or a flash lamp.
Case Studies about Material Testing
Lock-In Thermography is Integrated in IRBIS® 3 Software
Material stress test
Active thermography can detect defects even more precisely when the activation of the test object will be carried out in a pulsed mode. Thereby it will be possible to detect faults which are located in deeper subsurface layers. Such analysis algorithms like the one of lock-in thermography are already available as a module of the IRBIS® 3 software family. The adaptation to the specific application can be done quite easily with flexibility. InfraTec can also provide customer specific and complete active thermography test solutions.
